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Taiwanese semiconductor company, MediaTek, has announced the release of their latest midrange chipset, the Dimensity 7200. This new chipset boasts 5G support, power efficiency, and game optimisations, making it a great addition to the affordable smartphone market.
The Dimensity 7200 uses an advanced 2nd Gen TSMC 4nm process similar to its high-end sibling, the Dimensity 9200. It has an octa-core CPU with two ARM Cortex-A715 performance cores clocked at up to 2.8GHz alongside six Cortex-A510 efficiency cores. According to MediaTek, the Dimensity 7200 scores slightly higher than Snapdragon 7 Gen1 in Geekbench results, showing its impressive performance for a midrange chipset.
"The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts who are looking for an affordable way to squeeze the most battery life out of their phones without skimping on performance," said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
The graphics unit of the Dimensity 7200 is a quad-core ARM Mali G610. The company claimed that it can score between 100-120fps on the Manhattan GFX benchmark. It also supports Full HD+ resolution displays and up to 144Hz refresh rate, making it an excellent choice for gaming.
The Dimensity 7200 has HyperEngine 5.0 technology for AI-based Variable Rate Shading (VRS), which optimises the chipset's performance to ensure better battery life and smoother gameplay. In terms of camera capabilities, the new chipset features MediaTek's Imagiq 765 and a 14-bit HDR-ISP, allowing it to support main cameras of up to 200MP.
The chipset has a built-in 5G modem that supports the latest 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink. It also supports tri-band Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. In theory, all these features could make the Dimensity 7200 a great choice for budget 5G smartphones.
The MediaTek Dimensity 7200 will power midrange 5G devices launching in the global market in Q1 2023. Vivo V27 is rumoured to be one of the first upcoming devices to be powered by the chipset.